3D IC integration and packaging = 集成电路三维系统集成与封装工艺
(美) John H. Lau著 ; 曹立强, 刘丰满, 王启东中文导读., 刘汉诚, author (Author), 曹立强 (Writer of introduction), 刘丰满 (Writer of introduction), 王启东 (Writer of introduction) / (Mei) John H. Lau zhu ; Cao Liqiang, Liu Fengman, Wang Qidong zhong wen dao du, John H. Lau (Author), Liqiang Cao (Writer of introduction), Fengman Liu (Writer of introduction), Qidong Wang (Writer of introduction)
Print Book, English, 2017
科学出版社, Beijing, 2017