Thermomechatronics of Power Electronics
The coupled effects of mechanical stress and thermal expansion on the electrical function of power electronic circuits are explored within a new analytical framework called thermomechatronics. The problem of interest is the progressive performance degradation of the power electronics owing to the growth of thermomechanically induced fatigue cracks within the die-attach interlayer between power devices and substrates. Building on previous efforts, the present analysis focuses on experimentally confirming the system-level degradation of a simple power electronics circuit subject to variations in junction temperature of the electronics that would result from variations in interlayer damage
Chapter, 2003
Electronic and Photonic Packaging, Electrical Systems and Photonic Design, and Nanotechnology, 20030101, 241
2003